Place directly into PCB or plug into bk/pcs holder
Compatible with leaded and lead-free reflow and wave solder
Solderability: EIA-186-9E method 9
Detailed Description: Bussmann SR-5 Series Subminiature fuse is a radial leaded time-delay thru-hole fuse that is used for primary and secondary over current protection. It can be mounted directly into PCB measures 8.5 mm diameter. It is suitable with leaded or lead-free reflow and wave solder. It has high inrush withstand capability. It has an operating temperature from -40 deg C to +85 deg C and the soldering heat resistance of 260 deg C at 10 seconds maximum. It has a current rating of 315 milli-Amps and the voltage rating of 250 VAC. It has 0.43 Ohm of DC cold resistance and 152 milli-Volts of voltage drop at 20 deg C rated current. It also has an interrupt current rating of 35 Amps at rated voltage.
Mfr. # | SR-5-315MA-BK |