Dimension: 0.620 Inch Width x 1.500 Inch Depth x 0.730 Inch Height
100% performance tested - Confidence that each jack module will deliver the critical electrical
Improved termination cap: conductor retention slots simplify jack module termination
True strain relief controls cable bend radius for long term installed performance
Individually serialized marked with quality control number for future traceability
RJ45 interface industry standard interface provides a quick and easy plug and play
Can be clearly identified with optional labels and icons for port identification
Panduit Mini-Com® TX5e™ Category 5e/Class D Jack module in black color is made up of an ABS housing and tin plated over phosphor bronze integrated shield. It includes a zinc with plastic wire cap and measures 0.620 Inch x 1.500 Inch x 0.730 Inch. Module has a red colored termination cap that controls cable bend radius and securely retains the wires. It features an integral shield that provides a 360 deg conductive path to ground shielded jack module and a seamless bonding of the jack module with Mini-Com® modular patch panel.
Module is provided with a tab of size 0.187-Inch for grounding the individual jacks and accepts 6 or 8-position modular plugs. It terminates 4-pair, solid or stranded shielded twisted pair cable of size 22 - 26 AWG with a resistance of 100 Ohm. Module utilizes enhanced Giga-TX ™ technology for jack terminations that optimizes performance by maintaining cable pair geometry and eliminating conductor untwist. It features contacts plated with 50 micro-Inch of gold for superior performance and has one module space.
|Catalog Description||Category 5e, RJ45, 8-position, 8-wire universal shielded black module with integrated shield, Black.|
|Ships Ground. Eligible for expedited shipping||Yes|
|Standard||Exceeds ANSI/TIA-568-C.2 Category 5e and ISO 11801 Class D Channel and Component Requirements at Swept Frequencies up to 100 MHz. Complies with ANSI/TIA-1096A, Supports IEEE 802.3af/802.3at and Proposed 802.3bt Type 3 and Type 4 PoE Applications, Meets IEC|